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  • 回流焊炉的温度曲线怎么看
  • 本站编辑:杭州欧海自动化设备有限公司发布日期:2021-04-09 14:17 浏览次数:

回流焊炉的温度曲线怎么看

  回流焊炉温区的工作原理就是当组装PCB板在金属网式或双轨式输送带上,通过回焊炉各温区段的热冷行程(例如8热2冷大型机,总长5-6m的铅回焊炉),以达到锡膏熔融及冷却愈合成为焊点的目的,其主要温度变化可分为四部分:

  1、回流焊炉起步预热段指比较前两段之炉区,从室温起步到达110-120℃之鞍首而言(例如10段机之1-2 温区)。

  2、回流焊炉的升温(恒温)吸热段指回流焊炉曲线之缓升而较平坦的鞍部(例如10段回流焊炉之3-6段而言,时间60-90秒.),鞍尾温度150-170℃。希望能达到电路板与零组件的内外均温,与赶走溶剂避免溅锡之目的。

  3、回流焊炉峰温强热段(回流焊炉的熔融区)可将PCB板面温度迅速(3℃/秒)冲高到235-245℃之间,以达到锡膏熔焊的目的;此段耗时以不超过20秒为宜(例如10段回流焊炉之7-8两段)。

  4、回流焊炉的快速冷却段之后再快速降温(3-5℃/秒)使回流焊接点能瞬间固化形成焊点,如此将可减少焊点之表面粗糙与微裂,且老化强度也会更好(例如10段回流焊炉之9-10段)。

回流焊炉温测试仪

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How to look at the temperature curve of reflow soldering furnace

The working principle of reflow soldering furnace temperature zone is that when PCB board is assembled on metal mesh or double rail conveyor belt, through the hot and cold stroke of each temperature zone of reflow soldering furnace (for example, 8 hot and 2 cold mainframe, 5-6m lead reflow soldering furnace in total length), the solder paste is melted and cooled to become solder joint

1. The preheating section of reflow soldering furnace refers to the first two sections of the furnace, which start from room temperature to reach 110-120 ℃ (for example, 1-2 temperature zone of 10 section machine).

2. The temperature rising (constant temperature) endothermic section of reflow soldering furnace refers to the saddle part of reflow soldering furnace curve which rises slowly and is relatively flat (for example, for 3-6 sections of 10 reflow soldering furnace, the time is 60-90 seconds), and the saddle tail temperature is 150-170 ℃. We hope to achieve the purpose of uniform temperature inside and outside the circuit board and components, and drive away the solvent to avoid tin splashing.

3. The high peak temperature hot section (melting zone of reflow soldering furnace) of reflow soldering furnace can rapidly increase the PCB surface temperature (3 ℃ / s) to 235-245 ℃, so as to achieve the purpose of solder paste welding; this section should take no more than 20 seconds (for example, 7-8 sections of 10 reflow soldering furnace).

4. The rapid cooling section of reflow soldering furnace is followed by rapid cooling (3-5 ℃ / s) so that the reflow soldering point can instantly solidify to form solder joint, which can reduce the surface roughness and micro crack of solder joint, and the aging strength will be better (for example, 9-10 sections of 10 reflow soldering furnace).